The U.S. plans to expand restrictions on equipment containing components from Chinese entities on the Entity List; China imposes sanctions on 20 Japanese companies; Apple plans to source memory chips from ChangXin Memory Technologies; construction of a 28nm chip factory in Shanghai has begun.

2026-07-04 行业动态
Digest · 4 Jul 2026 Semiconductor · AI · Supply Chain

⚖️ Trade · Sanctions · Export controls

China places 20 Japanese entities on export control list

Including the Defence Research Institute, cited for military capability enhancement. Effective immediately under China’s export control law.

US FCC proposes ban on devices with Entity List components

Would prohibit sale of equipment containing parts from Entity List companies in the US.

Apple in talks to buy CXMT memory chips for China devices

Negotiations with ChangXin Memory (CXMT) and YMTC ongoing; no final deal. Would expand Apple memory suppliers to five.

🏭 Fabs · Manufacturing · Capacity

Shanghai Lingang · XinGang Integrated project breaks ground

Phase I focuses on 55nm–28nm planar IC manufacturing. 620,000 m² site; delivery by end‑2027.

Dongfang Suanxin (东方算芯) launches · Wei Shaojun as Chairman

New company focused on 3D AI chips; website and WeChat official account went live July 1.

Samsung Display expands 6G OLED line in Asan

Adds 15,000 sheets/month capacity; part of 140 trillion KRW Chungcheong investment.

💰 Pricing · Supply crunch · Components

AMD raises GPU + GDDR bundle prices ~10% (July)

Second hike in six months; affected AIB partners: Sapphire, ASUS, XFX, HanKai.

Yageo raises capacitor prices across all lines (July 1)

MLCC, aluminium, tantalum, polymer, film, supercapacitors all affected.

Sien Integrated (芯联集成) to raise prices 15–25% (Q3)

Effective Q3 2026.

Microchip raises MCU quotes (mid‑August)

Price adjustment on select products.

ASE raises advanced packaging quotes up to 20%

Across all advanced packaging technologies.

Malaysia seizes $13M AI chips at airport

Advanced AI chips valued at 52.9 million MYR (~US$12.9M) intercepted.

🏢 Corporate · M&A · Partnerships

Microsoft to cut <2.5% of staff (reported next week)

New round of layoffs expected.

Elon Musk’s acquisition of Mesh Optical approved

High‑speed optical module startup; FTC clearance obtained.

AI data‑centre startup Crusoe seeks $3B funding at $30B valuation

Valuation could triple.

Google loses EU antitrust appeal · €4.1B fine upheld

Android case; court ruling may tighten big‑tech regulation in Europe.

Intel wins Google TPU packaging order from TSMC

Google next‑gen TPU to use Intel EMIB‑T instead of CoWoS.

Anthropic in talks with Samsung for custom AI chip

Samsung as manufacturing partner.

🔬 Technology · Nodes · Packaging

Kioxia to mass‑produce 10th‑gen BiCS flash

Ceremony at Kitakami plant; co‑developed with Sandisk.

Samsung accelerates 1.4nm (SF1.4) · targets 2027

Competing with TSMC’s advanced nodes; PPA and yield will be key.

NVIDIA cancels 4‑die Rubin Ultra · moves to dual‑GPU design

Manufacturing challenges cited.

Qualcomm to launch Snapdragon 8 Elite Gen 6 (2nm) at Sep Summit

Snapdragon Summit 2026: Sep 22–24, Hawaii.

TSMC builds local DRAM supply chain · Winbond joins

Strategic partnership for AI applications.

Vanguard International Singapore 12‑inch fab trial · >99% yield

Positive early results.

📊 Markets · IPO · Capital

Goldman raises 2027 HBM price forecast for Samsung

Annual growth revised from 14% → 44%.

Q1 2026 global foundry 2.0 revenue +23% YoY · $86B

Driven by AI GPU and ASIC demand. (Counterpoint)

H1 2026 semiconductor IPO: 31 filings, 7 withdrawals

Aggregate withdrawn proceeds > ¥8B.

62 semiconductor firms queue for A‑share IPOs · ¥146.4B target

Covering design, wafer, equipment, packaging.

Basic Semiconductor (SiC) lists on HKEX under Chapter 18C

Third filing; IDM player, raising ~HK$866M.

📱 End devices · Consumer

Apple to launch 5 new iPhone models · foldable at 10M units

H2 2026 – H1 2027 rollout.

Apple to launch new iPad Pro & redesigned MacBook Pro in 2027

Part of iPhone 20th anniversary lineup.

HarmonyOS 6 hits 70M devices

Official announcement July 2.

REDMI K90 Ultimate Edition launched · Snapdragon 8 Elite

Gaming‑oriented, starting at ¥2799.

🖥️ Display · Optics · Components

Samsung to invest 140T KRW in Chungcheong IT materials hub

AI‑era global centre for materials & components.

Omdia: RGB LED TV revenue to reach 13% of global TV market by 2030

Up from 3% in 2026; Mini LED and RGB LED driving growth.

📡 Communications · Policy

Eight Chinese ministries target 50,000 industrial 5G private networks by 2030

Also: 5 world‑class platforms; core industry value > ¥2.5T.

Compiled · July 4, 2026 #Semiconductor #AI #Trade #SupplyChain #Display #5G